Plasma Vapour Deposition (PVD) technologies consist of the evaporation of a material and its deposition as a thin film over an object (known as substrate). This process allows to prepare metal coatings, but also ceramics such as nitrides, oxides, or carbides. All PVD processes are performed in vacuum, and layers between tens of nanometers to tens of microns can be tipically prepared.

Although the evaporation of the material can be performed in several ways, in Nano4Energy the most common employed method is magnetron sputtering. We relay in the HiPIMS power supplies we develop to obtain dense, smooth, and high quality coatings.

The technology behind magnetron sputtering does not require the substrate to be metallic nor conductive, and therefore materials such as glass, ceramics, and plastics can be coated. This fact, in addition to the low temperature of the coating processes (below 100ºC), increases the variety of applications of this technology.

When compared to its technological competitors (such as wet chemical surface treatments), PVD represents a clean alternative, without requiring hazardous compounds, nor generating water pollutants or chemical waste.